Asus WS X299 PRO - Moederbord

5-Way Optimization\nOne-click overclocking and cooling\nASUS 5-Way Optimization makes your workstation smart. One click takes care of complex tuning, dynamically optimizing essential aspects of the system to provide overclocking and cooling profiles that are tailored for your rig.\n\n- An automated tuning utility that optimizes overclocking and cooling profiles for your unique system configuration.\n- Fans stay whisper-quiet with everyday computing, and deliver optimal airflow when the system is crunching through CPU or GPU-intensive tasks.\n- Stress test function helps optimize and overclock for CPU- or memory-centric workloads.\n\nMake your memory go faster\nWith optimized trace paths for time-aligned signaling and minimal crosstalk, third-generation ASUS T-Topology offers enhanced memory stability and compatibility, allowing support for memory speeds of DDR4-4133MHz and beyond.\n\nOC Design – ASUS PRO Clock II Technology\nWS X299 PRO includes a dedicated base-clock (BCLK) generator that extends CPU and memory overclocking margins. This custom solution works in tandem with the TPU to enhance voltage and BCLK overclocking control, providing the flexibility to extract every ounce of performance from the Intel® Core™ X-series processors.\n\nMulti-GPU support\nWith support for both NVIDIA® SLI™ and AMD CrossFireX™ 2/3-WAY configurations, WS X299 PRO enables multi-GPU setups so you can harness the full power of the latest graphics technologies to drive games at 4K and beyond.\n\nFlexible Cooling Controls\nWS X299 PRO features the most comprehensive cooling controls ever, configurable via Fan Xpert 4 or the UEFI BIOS.\n\nUltra-efficient VRM Heatsink\nDesigned for the powerful Intel Core X-series processor with up to 18 cores, WS X299 PRO features a capable thermal design to ensure maximum performance with no CPU throttling. Consisting of an ultra-efficient VRM heatsink with a metal fin array design that maximizes surface area for heat dissipation, plus two additional heatsinks and a connecting heatpipe to further increase cooling performance, this innovative thermal design ensures WS X299 PRO is always ready to handle any task, no matter how demanding.\n\nDual Onboard M.2 & M.2 heatsink\nPerfected cooling for unleashed performance\nWS X299 PRO features dual onboard M.2 slots, each operating at X4 PCI Express 3.0 to provide an abundant 32Gbps of bandwidth. Both slots sit below the X299 chipset and are covered by a heatsink that reduces drive temps by as much as 20°C, ensuring peak performance under all scenarios.\n\nVROC\nUpgrade your RAID\nUnleash the WS X299 PRO Virtual RAID on CPU (VROC) with the addition of an ASUS Hyper M.2 X16 Card*, which allows you to attach up to four PCIe® 3.0 x16 M.2 drives — for a total bandwidth of up to 128Gbps. PCH-based RAID arrays are bottlenecked by the 32Gbps limit of the DMI bus. VROC obliterates that limit by allowing you to utilise CPU PCIe lanes to configure a bootable RAID array that can transfer data at insane speeds.\n\nUSB 3.1 Gen 2 front-panel connector\nFuture-proof connectivity\nWS X299 PRO's front panel USB 3.1 connector is ready for next-gen PC cases and devices.\n\nUSB 3.1 Gen 2 Type-A & Type-C\nUltimate-speed 10Gbps with USB 3.1 Gen 2 onboard\nWith backward-compatible USB 3.1 Gen 2 Type-A™ and reversible USB 3.1 Gen 2 Type-C™ ports, you'll experience ultimate connection flexibility and blazing data-transfer speeds of up to 10Gbps.\n\nDual Intel® server-class Gigabit LAN\nFor more reliable networking, WS X299 PRO features the latest server-class dual Intel® Gigabit LAN ensuring lower CPU utilization and temperatures outstanding performance as well as better support for diverse operating systems. The dual Ethernet ports also support teaming which combines the network links to provide higher throughput or redundancy in case of failure.\n\nIntel® Core™ X-series processors for LGA 2066 socket\nIntel Core X-series processors (6-core and above): 4-channel (8-DIMM), 44/28 PCI Express 3.0/2.0 lanes.\nIntel Core X-series processors (4 core): 2-channel (4-DIMM), 16 PCI Express 3.0/2.0 lanes.\n\nIntel® X299 Chipset\nThe Intel X299 chipset supports LGA 2066-socket Intel Core X-series processors. It provides improved performance by utilizing serial point-to-point links, allowing increased bandwidth and stability. Additionally, X299 provides a maximum 10 USB 3.1 Gen 1 ports, 8 SATA 6Gbps ports and 32Gbps M.2 support for faster data retrieval.